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№ US 0003160844
МПК G01L9/00

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Формула изобретения

IR hole 109 is provided iii the upper surface of the cover 82 'to nermit the interior of the transdi-icer to b-- evacuated of all -ases the a-,cess hole 109 then being sealed with solider. After sealing, atmospheric pressure introduced into the interior of the bellows 95 throti,-h the threaded aperture 86 and the hole 39 will cause the bellows to tend to expa-.id. The effective area of the bellows ard the system stifi-,.icss is slch that 0.004 inch of relative moveriient of the bellows surface 96 aid 97 is typical. The crystal bearr. sensor 40 is then deflected 0.002 irch ov,@rcenter in the direction opposite to that caused by the bias spring adj'ustment (i.e., the beam is deflected upwards). If the absolute pressure i-.itroduced into the threaded aperture 86 is gradually redticed from oneatmosphere down to zero, the bias sprin,-, crystal beam sensor, and bellows system will in unison relravel the 0.004 inch to the init;al preload,-d position. At an37 point i-.1 between, there w;il be an equilibritim belween the force exerted by the "sprirg" system and the summed force due flo the pressure diff-crence between the bellows interior and exterior over the b-.Ilows effective a;ea. Simultan--ous with the bellows movement is a liri@,ar cl-iange in strain in the -auge are,i of the crystil bcai-i sensor. Tiie strain chaii-e caus--s an el-.ctrical resistance change of about nlus or minus 70/0 in gaii-es. The electrical circuit s@own in FIGURE 13 is utilized to detect this resist-cince chan.-e as a bridge unbalance volta-e. Upoii remembering that th.- lenrtl-t of the crystal beam sensor 40 is only 1/2 inch, it is repdily appareiit that the illustrated,presstire transdticer can be very compact, a volti-!-ne of less than 1/2 cub-'@c inch and a v,7eight of less than I ou:lce bcing easily obtain,,)bl--. Utilizing a 15 p.s.i.a. range, ',t is easily possible to obtain 0-2 volts output with 20 volts input without the use of auxiliary amnlifiers, as compared wilh a typical full range ou'put of 0.04 volt witla a 10 volt,input for a wire str,-,in ga,,i,-ebarometer. N-,I'Ilcn utiliziig the illustrated pressure transducer as a microbarometer (15- p.s.i.a.), the relatiie stiffnesses or sprin.- rlites of the b--Ilows 95, the crystal b-.am s-,nsol,!O, -,nd biis sdring 1'-, I are respectivel@v 1, 0.7 ai3il 3.3 tinits. wl-,ere I uii;t is ec,,,,i.@,alent to a p-rcssiire of 81 pol,inds per inch. The total or system spring rate in tile operatin- direction ;s 5 un;ts, or 5 tilnes the bellows st -Ctll,,SS. Ne-iLher the system s-,r;n.- rate .qor its linearity arkopreciably altered by the biis-s-orin--- actio-@i or its adjustment. Tb@e most highl@y stressed member of the system is the cryslal b,-am sensor 1,0. S-ingle crystal silicon is bysteres;s fr-,e, and the systein hysteresis is minim-l:zed by k-.-eping the op-.ratin- stress,-s low in the bellows and in the biis sdr;ng. The perpendicular align-ment of the bias spri,ig witli the crystal bea-n sensor provides lateral support in tie cross-axis dir--ction (transverse to the operating axis), so tliqt th-. system is relati@rely immune to vibratioi-i. 1- @i a,-I..Iitioti, dile to the sirall physical size of the b-,irometor, the lowest resoiiant f.- equency alona. any axis is in excess of 2.000 cycles ner secoiid, a resonant freconsiderably hi.oher than that of most b,,ironicters. Therefore, the illustrated pressure transducer is rugged as well as cor@ipact arclseiisi'live. Thu.-s, t,iere has been d,-@scribed hereinabove novel piezorc,sis@-1ve scinsors of ilite.- ral crystal construction, to.---ther with a novel practical embolimei)t 6f the;r tise in a presstir-- transducer. The il I lustrated cr@ibodiments of the p,.ezoresistiv,- sensors provided four active gauge ele m.-r-ts properly oricil@,.-d and ir@terconnected for use in a I .Lour.arm brid-c circuit. l@, is readily apparent, ho@Nev--r, that the present nve-@ition strtictural coiicedts can be utilized to provid-@ s,ii,-Ie crystal piezoresistive sensors liavillI a di.Fi-ere@it nurqber of.active gau-es. For example, n-icrely by cuttin-, i@i half t,ic sensors illustrated in FIGURES 9 ,ii-@d 1 1 of tl,,- drawing a'@oiig the lon.a;tudinq @zroove 31, a pe.4r oir two-ga,,l-,e sensors would r.-sult, the two arm 3,160,844- 12 circuitry reaulriii,- oqly three electrical leads instead of four. Also, difi'erent conslruction techn;ques -nay be followed iii the ftbr,.-,ation of the present inv--Dt:oii piezoresist;@Ve sensors. For exaiiaple, flbrication n-i-ight be simplified by constructing the piezoresistive sedsor in the form of upper and lower beam h,-:@Iv-;;s a@7,d cementing the halves to-et@ber alo-@ig the neutral a,,is of th-, resultant sensc)r beam. SuCii a procedur@, would s;mpli-,'Y the foi-mation io ot ttie @,ariols -@@ooves and -.ttac,iment of the electrical cc-n@Lacts a.-id le!@ds. Of cou,,se, al'Lhoti,@,,h a feature o:,' the illti-.trated embodimciits provided ail of the electrical coiitetcts on oic beam sL@.rface, some of the contacts cculd be prov-;,,'ed oil opposiii- bec-,m s,,irfi@ce where the ac13 ii,,e gau,-Cs are p'-)s;tioned. Furthermorp-, the concept of @-, l@Our -@ctive arm syste-rii '@s also -applicabic to conv-,-@itioiia-Ely bonded SCM;CODductor strain aauges, each activ.- gau.-e element be@r@-I mechanicplly bo-@ided to the proper surface o'L a beam. T',-lus, althougl-, the in20 ventioli lias been described w,'tli a certa@'@n degree of particularity, it is ,iiiderstood that tli@- present disclosure iias beei iiiade only by way iof example and thit,,iuiii@-rous cha,.-I.-cs in the dctai-s of consrli.-tion and tLe coiiibiii,,itio@i @,,iid ar---aiigemcri-' of parts m-,iy be resorted to with2,5 otit d,-partiii,@ from t'@i.- spir;t t-li,- scope of the in@,enlio-Ti as hereinafter claimeci. '@,Vhat is c"aiiii-,d is: 1. A s%-,,@iiicoDductor st.-a-ir,. gauc7-, CO@'riDrsing: (c,) aii clongate single s@-miconduclor crystal ;ot pre@-,elermined cryst,,il@io-r,,iDh;c orien'@atio-,i @ind ol a fiest i)red,-terniined condu@ctiviiy tyr.,e, said sem-icolilucter cry-.tal dei@n;n,- firs' iid second opi)osed Ion.-itu--'in-al surfaces, -irst ai,,d secoqd loii,-7@ttjdiDal s,,ir-faces ancl 'the end surfaces of s-,i;ci containiir @5 thereiti active im,-Lir;ty atgins of a secoild pred.- termined co!-iducVll:lty type to thereby define a shallow p@-r-PlIl -i er-,il sti.-fac-. band o'L said secoid predetermir@ed con,-'-Lictivity type loiagILudir@ally croirelitig said crystal exclu,@,.ve, of its longitudii-ial edf.@e sur40 face, said peripheral s-Lirf,,Tce bind of said s@-.cond predcterii-iiied co,,Pductivity type be;ng c-icetrici'@ly isolated frori the re.-iiainir.,g first cond,,iclivit@y t,li"3e i?ort;c@i of said crystil by the higti imp.-dancf-- b.-rrier provilled by the juiictic.;i thpr,-betw,-en, said crvstal 4:5 nL,@,ipg a plurality of predetermirc@i rooves iii the aiid c-@id -iir,laces tlie.-eojw-,ii@diy ibi-ou,@h sai-I sor@Lace and r)elietratiti@ the Linderlyiiig junct-.on, isaid grooves di@,ilin.- sqid b.,ind inlo di'screle el@ec@Irically -@'solated surface re-iors of 50 said second pred,termiiied @coi-iductivity typ--; and (1-,/) 0,, pitiraity of clec-'ricii coitncts, ohmically boi,,ded to predeterm".Ped roints on- E,- Ion-_itudinal surface of sciid body for copnection of clecttical meosuring circu;try theieio -for meas!,ire-riiciit of ciiaii.-es in 'the r@,3 el--ctrical resistance ol. sa,@-I discrete slirilace rc,,-ior,,s betwee-@l said coniac-s ii-,ion s'@rp-ssing ef sliid 2. A semiconducto.- stral-ii gauge comprising: (c,) I an elonaat-. sin,@le scmiconductor cristal of P tYPe -sil;co-Ti of LIOCil crysLa',Io.-raplii-- 60 said seinico@idtictor cryst-il defnill,@ fi.-st and secoi,2d o..nposed longitudir@,il surfaces, said --@irst and second lor@gitudinal surfaces aqd the end surfaces o@L Sl-id si'@icorl- cry-"Ll,L coiitai-Tiing therei@-i a--t,'.Ve -',oms of N tyric coi,@]@o@ccivity to threby defl-iie I 65 siallov@r peridheral sur-Lace baild of N type conduetivity longitudinally crcirciiiig said crystal -,xclus@ e of i's !G.,i,-i*ludin,,il sieic surfaces, said 1,1 tvde sur@@,tce ba@i,@: beill-, eleclrically isolated from tl,,e - remq,;niti, P type rort;on of said crystal b..-d3,, by the hi.-h i,,ii@o pedar@ea bar@rier provid,-d by @he PN ji-inction the,--- betweeii, sa@.'d crystal h,,tv-1r@.- a i)'Aurality of rreocgtoo-,,;es in tLe etid s,,ir.. face-@ tli@-reof exte@,acl.-Ing inwii-dly throtig'@i saic, N ty,7,c bc-tiid tnd -,@cne,rat'n@ th,-- Pi.I jiliac75 t' s@-tid groov-,s said. N typo bai-,d ir,b

@,160,@44 13 dl,,;crete electrically isolated N typ-, surface re.-ioais; and (b) a plurality of electrical co-iitacts olir@-iically boiided to predetermined points oii a longitudinal stirface of said body for connection o)' electrical measuring 5 circuitry thereto for r@easurement of changes in the electrical resistance of said discrete N type surface re.aions between said colitacts u,,)o-@l stressing of slid crystal. 3. A semiconductor strain -ail.-c comprising: 10 (a) an elongate sin.-le semicondurtor @erystal of N type conductivity of [111] crystdlographic oriertation, said silicon cryslal defining first atid second opposed longitudina.1 suri-aces, s,,iid first and second longitudinal surfaces and the end suriaces of said 1,5 silicon crystal containing 'Lherein activ-- impurity atoms of P type condu,ctivity to thereby define a shallow perinheral surface band of P type conductivity encirel-ing said crystal exellisive of its longitudi-@ial side surfaces, sa;d P tyl)c surface band being 20 clogtrically isolated from the remtinin.- N type portion of said s-ilicon crystal by the high impedance barrier provided by the PN junction therebetwec-@i, said crystal having a plarality of predeterr.,ii-iied grooves in the Icngitudinal and end surfaces - thereof 25 extending inward!3! 'Ll@iough said P type surface baiid and penetrating the underlying PN junction, said grooves dividing said P typc,@ baiid into discrete electrically isolated P typa stirface regions; and (b) a plurality of electrical coptacts ohmically bonded 30 to predeterniined po-nts on a longitudinal surface o-f said body f-or cornection of electrical m&-isuring eirciii'Lry thereto for measurement of cbanges in the electrical resistance of saitl discrete P type surface regioiis betnveeii said contacts Lipon stressing of said 35 crystal. 4. A sem,@'conductor strain gauge comprising: (a) an elongated single s-@miconductor crysta@l of predetermined crystallographic orientation and of a first predetermincd conductivity type, said senii- 40 conductor crystal defining first and second opposed Ion.-itudinal surfaces, said first and second longitudinal surfaces and the end surfaces of said crystal having diffused therein active iinpurity atoms of a second predetermined conductivity type to thereby -15 deflne a shallow peripheral surface band of said second predetermined conddctivity type lon,@itudinally encircling said crystal exolusive of its longitudinal side sur'taces, said peripheral surface band of said second cotiductivity type being electrically isolated 50 from the remaining first conductivity portion of said crystal by the Iiigh irnpedance barrier provided by the junction thereb-@twecn, said crystal havin.a a transverse groove near one end thereof extending across said first longitudinal surface, said groove extending 55 inwardly into said crystal from said first longitudinal surface through said peripheral surface band and penetrating the und,- rlying junction; (b) a first electrical contact ohmically bonded to said first longitudinal surface of said cry8tal at said one 60 end thereof adjacent said groove-, (c) a second electrical contact ohmically bonded to said first longitudinal stirface of said crystal adjacent said groove on the opposite side of said groove from said fa-st elpctrical contact; and C)5 (d) a third electrical contact ohmically bonded to said first longitudinal surface of said crystal body near the other end thereof. 5. A semiconductor strain gauge comprising: (c) @an el,-z,,-ate single semicondiictor crystal o@L P tyi,7e 70 silicon having a [1001 crystallographic orientation, said silicon crystal defining first and second opposed Ion.-itud,inal surfaces, said first and second longitud;nal stirfaces and the end surfaces of said crystal h,tviilg difl'uscd therein active impurity atoms of N 75 14 type conductivity to thereby define a shallow peripheral surface band of N type conductivity longitudiiially encircling sa;d crystal exclusive of its longitudinal side slirfaces, said peripheral N type surface band beiiig electrically isolated from the remainiiig P type portion of said crystal by tne high impedance barrier provided by the PN junction therebetween, said crystal having a transverse groove neqr one end thereof extendinp, across said first longitudinal surface, said groove extending inwardly into said crystal from said first longitudinal surface through said N type sur-ace band and penetrating the underlying PN junction; (b) a first electrical contact ohmically bonded to said first IcTg;tudinal surface of said crystal at said one end thereof adjacent said groove; (c) a s@-cond electrical contact ohmically bonded to said fn-st longitudinal surface of said cryst,,il adjacent said groove on the opposite side ol' said groove f-rom said first electrical contact; and (d) a third electrical contact ohmically bonded to said first longitudinal surface of said crystal body near the oth.-r end thereof. 6. A semicoiiductor strain gauge comprising: (a) an elongate single semicoiiductor crystal of N type silico-.,i having a [111] crystall@ograph;c orientation said silicon crystal deflning first and second opposed longitudinal surfaces, said iirst and second Ion.-itudinal surfaces and the end surfaces of said crystal havin.- diffused tlierein active impurity ato-m@ s of P type conductivity to thereby define a shallow periphcral surface band of P type conductivity longitudinally eileireling said crystal exclusive of its lon,@itudinal side suriaces, said peripheral slirface band of P type conductivity being electrically isolated from the reniaining N type portion of said crystal by the high impedance barrier provided by the PN junction therebetween, said crystal having a transverse groove near one end thereof extending, across said first Ion.- itudinal surface, said groove extendin.- inwardly into said crystal from said first longitudinal surface through said P typ@- sirfac@- band and penetrating the underlying PN junctioii; (b) a first electrical contact ohmically bonded to said first longitudinal surface of said crystal at said one c-@id thereof adjacent said groove; (c) a second electrical contact ohnlically bonded to said first long-@tlidinal surface of said crystal adjacp-nt said -roove or th-, opp-os,@'te side of s@@id gr,oove -from said first electrical contact; and (d) a tliird electrical co@itact chmically bonled to saicf f,@rst Ic-ngitudiral siii-face of said crystal boay n,-ar the olher end the-reof. 7. A semiconductor straiii gauge comprising: (a) an clon.-ate single semiconductor crystal of predetern-iined crystallo,-raphic orientation and of a first predetermined conductivity type, said semiconductor crystal definin.- first ard seco-Tid opposed longiti-idinal surfaces, said first and second longitudinal surfaces and the end sur@faces of said crystal having diffused therein active impurity atoms of a second predetermined;conductivity type to thereby define a shahow p-.rip@ieral surface baiid of said second predetermined coiidtictivity type longitudinally encircling said crystal exclusive 'of ills longitudinal side surfaces, said peripheral 's,,iriac-- barid of said second conductivity type bein.- electrically isolated from the remaining first conductivity portion of said crystal by th-- high ii-npedance barrier provided by the junctioil thei-,between, sa-ld crystal haxting first and secor@d third -rooves th,@rein, said first groove extending longitudinally peripherally around sa;d crystal through the lon,@itudinal surfaces and end surfaces thereof, said second groove being in said first surface hear oie end of said crystal

3ilGO,844 Is aiid extendin,- t@.-ansversely from sail first groove to one longit-adinal side sur-face of said crystal, said third groove being in said first Ion.-itudinal surface near said one end o.'L said crystal and extending transv--rsely from said first groove to tiie other longitu5 dinal side surface of said crystal, said grooves extending inwardly into said crystal ttirou,-h said p.-ripher,@il surface band and penetrating the underlyin.- junction; (b) a first electrical contact ohmically bonded to said 10 first Ion.-itudinal stirface of said c.-ystal at said one end thereof adjacelit said second groove; (c) a second electrical contact ohmically bonded to said first lon-itudi-@iai surface of said crystal body adjacent said second groove on the opposite side of said second 1.5 ,-roove from said first electrical contact; (d) a tliird electrical contact ohmically bo-iided to said first Ion-itudinal surfa-.e of said crystal body near the other end th--reof on one side of said f-@rst groove; (e) a fourth electrical contact obmically bonded to said 20 first longitudinal surface of said crystal at said one end thereof adjacert said third @roove; (f) a fiftl@l electrical contact ohmically bonded to said first longittidinal surface of said crystal adjacent said third groove o@i the opposite side of said third 25 ,@roove from said fourth electrical contact; and (g) a s:xlli el,@etrical contact oliniically bonded to sa@"c', first longittidinal surface of said crystal body near the other cr@d th,-reof on the other side of said first ,@rc,,ov,,. 50 8. A semicopductor strain gauge comprising: (,-) an cloii.-ate single semicoidulctor cry-.tal of P typc silicon h-,vi@-., a [1001 crysiallographic said silicon crystal deiining first and secoiid opposed longitudinal surfaces, said first and second longitu35 dinal surfaces and th-- end surfaces of said crystal havin- difftised therein active impurity atoms of N type condtictivity to thereby define a shallow p-.riptieral surface band of N type conductivity longitudinally encirelin.- said crystal exclusive of its loniyi- 40 tudinal side surfaces, said periph-.ral surface baiid of N type conductivity bein.- electrically isola'Led from the remainir@9, P type porl@lon of said crystal by the high in-ipadance barrier provided by the PN junction thereb--t@veen, said crystal hivina first and second and 45 third grooves th.-rein, said first groove extendi-@i-, loi-i.-itudinally perioh,-ral-y arour@d said crystal throu,-h the longitudinal surfaces and e-iid surfaces ,h.reof, said secopd -roove beiiig in said ilrst lo-@i.-itud@ina', surface near one end oj' said crystal and 50 extendin- transversely from spid first groo,,,e to one longitudinal side s,-lrface of said crystal, said third groove being in said first longitudiiial surface near said one end of said crystal and extendin.- transverse-ly from said first groove to the other - loi,,-,tur@ 5 dinal side surf,,ce of said crystal, said grooves extondin- inwardly -into said crystal through said N type surface band and peretrating the - underlying PN junction; (b) a first electrical contact ohmically bonded to said Go first Ion.-itudinal surface of said crystal at said one end thereof adjacent said second groove; (c) a second electrical co-,itact ohmically bonded to said first Ion-itudinal -@urface of said cryst,,il body adjacent said second -roove on the opposite side of sa;.d 65 second groove from said first ' electrical contact; (d) a third electrical contact ohmically bonded to said first lonaitudinal surface of said crystal body near the other end thereof on one sid@ of said fu-st groove; 10 (e) afourthelectricalcontact,ohmi --allybondedtosaid first loiigitudinal surface of said- cryst,,il at said one end tliereo'l adjacent said third grobve; (f) afifth electrical coiitact ohmically bonded to said first longitudinal surface of said crystal adjacent said -5 third groove on the opposite side of said third groove frorli said fourth electrical contact; and, (g) a sixth electrical contact ohmically bonded to said first longitudinal surface of said crystal body near the other end thereof on the other side of said first groo@,e. 9. A semiconductor strain gau,-e coniprising: (a) an elonga!C sei-niconcluctor crystal of N type silico-ii having a [ I 1 1 ] crystallographic orientalion, said s,'Iicon cryslal d4@fin'@iig first and seco-,id oppcsed lonpitudinal surfaces, said first alid second Ion.-itudinal surfaces and 't@e end s,,irfaces of said crystal having diffused therein active impurity atoms of P type conducti,,,ity to thereby define a shallow peripheral surface band of P typ-. conductivity longitudinally e@icircii,-ig saicl crystal exclusive of its loityitudinal side surfaces, said peripheral surface band of P type concluctivity being electrical'y isola'Led from thf,@ remai@ii@i.- N typo portion of said crystal by the hi,-h impedance barrier provided by the PN junction therebetnveen, said crystal having first and second and third grooiles therein, said first -roove extending longitudinally periphe;ally around said crystal through the longitudinal surfaces and end surfaces ther.-of, said second groove being in said first lon.@itudinal surface near one end of said crystal and extendin.- transversely irom said first -roove to one longitlidinal side stirface of said crystal, sa-id third groove b.-ing i-,i said first longitudinal surface near s,-tid one end of said crystal and extendin.- transversely from said first ,roove to the ol@her longitudinal side surface of said crystal, sa,.d 2rooves extendini,, inwardly into said ervstal through said P type surfac-, band and pene',ra@ing t@ic underlyir@.- PN junction; (b) a 'irst electrical cor@tact otimically bonded to said first lon-i@udinal surface of said crystal at said one eDd thereof adjacent sa-@d second groove; (c) a secor@d electrical contact ohmically bonded to said first Ion.-ituclinal surfac-- of said crystal body adjacent said sf--coid L,,roove oi the opt)osite sicle of said secf)iid -rbove )rom -z,, first clec'@r cal contact; (d) a third electrical contact ohmically bonded to said first loiigitudinal surface of said crystal body near tiie other end thcrc,,)f cii oic side of s,-,id firs, -roove; (e) a fourth electrical contact ohmically bonded to said first longitadinal surface of sa;d crystal at said one end thereof ndiacelit said third groove; (f) a fifth electrical contact ohmically bonded to said firsl longitudinal surface of said crystal adjacent said third groove on the opposit-. side of said third groove from said four@h ciectrical contact; and (g) a sixth elecir:ical contact ohmically bonded to said first longitudinal surface of said crystal body near ttic olher end thereof on the o,,",@er side of said fir@t groove. 10. A semiconductor s,-aiii gau-e compr.,sing: (a) an elongal,c s;ngl,- semiconductor crysfal of predetermiied r-rystal@log@-aphic ori,-ntit;on a-,id o,l a first predetern@ @@r,@-zd co-,i,- ],,lctivily type, said sediicoqduc"cr crystal defining Pzst and second orposed lor@-itud;nal si-irfec@-s, sa@d f-,rst and s@-cond lonf,,i@Udiriil surfaces a-@id the etid s-ari-aces of said crys'@al having,d,..ft'used tii,-rein act@'.ve impurity atoms of a seco-@id - orejetermir-led condiictivity type to the.-eby define a shallow peripheral surface band of said secoiid predetermined conduct,'.Vity type loiigituditiallv oneirel..ng said crystal exclusive of it3 lopgitudi@ial sid-, surfaces, said p-@riphcral s@ariacc band of sa;d second conductivily typo b,-,ng elec@ricallv isolat-@d from the rem@ai@-ii-iig fii-st conductivity portion o@ said crys+al by th-- hi.-h ii-ar-edance barr'@or r,,-o7i;d,-d by 'he j,,lqction ther,,betwe@--ii, said cryst-,il b,,ining first ajid second and third iiiicar gi-ooves therein, said first LI-@icar -,roove be@iiining at a 1-irst rredetermined po;@--t on sa;d first

17 longitudinal surface riear one end of said crystal and extending lopg-itudinally peripherally around said cr@rstal along said surface baiid to a secoiid predeterniined point spaced apart.Lror@i said first predetermined point in said first longitudinalsurface, said second groove bein@, in said first longit-adinal surface and extending transversely from the end of sai-d first groove at said rirst p.-edeteriii:,.i-,,l 1--.oiiit to one loilgitudiiial sio@e si.[Ff@ice of said crystal, said tliird groove being in s-,iid first longitudinal s,,irface and ex'Lending trtnsversely f-rom the other end of said iirst -roove at said second predetermined point to the otler longitudinal side surface o,4 said c@ryslal, said grooves extending inward,ly in',Io said crystal through se-,id surface b@and ,9,nd penetrating the underlyin.- junction; (b) a first electrical conlctct ohmicilly bonoted to said first longitudinal surface o'L said crystal near said one lon,gitudinal side surface tliereof between said second groove and said one end thereof; (c) a second electrical contact o!Lmically bor@ded to said first Ion.-itudinil surface of said orysta@l iiear said one longitudiiial side surfa-,e il-iereof proxiiiiate the other end thereof; (d) a third electrical contact ohwigally bopded to said first longitudinal surface of said crystal near said other longit,,Tdinal side surface ther--of b,-tweeii said third groove and said otie end thereof; (e) a fourth elect-rical contact oh,--iifally bondea- to said first longittidinal surj',,ice of said crystal near said other loiigitudi@ial side surface thereoi' adjacerit siaid third grooie op the opt)osite ,icle of said tiaird groove from said third electrical contact; and (f) a fifth elect@rical coiitact ohmically bonded to said first lon@giluiinal @surface of spid crystal near said otlier longitadinal side surface thereof adjacent said otlier end thereof. 11. A semicordugtor str,,iin g,).uge corrprising: (a) an dongate single semiconductor r-rystal of P-type silico.-i Laving a [1001 crystal',o-raphic crieiitation, said crystal def-@iiing iirst a,,.d seec-r@d opposcd longitudinal surfaces, said first and second Ion.-itudinal surfaces and the and surfaces of said cryslal liaving cl@'@iTtised therein -,iclive irc@purity atoris of 1,Ttype condtictiv;ty to ther--by define a shalloiv peripheral surface band of N type condlictiv-lty longitudinally encirrling said crystal excILsivc, of -its long,"tudinal sic;,e curfaces, said j)er;pl@7eral bai-id of N tyr@e condue,tivity being electrically isolated from the remaining P type portion of said o.-ystal by the high impedance barrier provided -by tL-c PN junction tlierebetween, s-,Lid crystal having fi@rst and second and third linear grooves th--rc@in, sa-ld first li@iear groove bcgii-@nin.- at a 'iqrst I)rede@ermined l@oin" on saicl first longitudinal surface near'one end of sai@ erystqlard ex@endin.a longittidinal@ly puipherally around said crystal a:long said N type surface band to a seco-tid predeterm@'@ned ipoint spaced ap-art frol@i said first predetermined point in said first longituclinal surface, s-,tid second @.-roove being in said first lorigituclinal surf,,ice and cxteiiding transversely from the end of said first groove at said -predetermined point to oiie longit-adinal side slrface of said crystal, said third groove being in said firqt lop.-itudinal sur-'.ac-. andextendin,-, trarisverscly 1'fom th@- other erid of said first groov-- at said second prcdetermined poiilt to the otti.-r loncitudinal side stirface of sa'Ld crystal, said grooves extc-iiding '@v,,liardly iiito said crystal through said N t@rp.- stirface band and peTietrat,'@ng th-. underlying PN iiinction; (b) a @qrst electrical contact ohmically bonded to said firs', longitudinal surface of &-tid crystal np-ar said otic loii-itlidir@al side surface th-,rlof bet@lieen said secoi,d groove 2,@-id sa,@d one -,7iLl li@@,-reof; (c) a second electrical coptact ohmically bo.7ided to said first lonpitudinal surface of said crystal near sa,;d 3,160,844 19 on-, longitudinal side stirtace proximate the oth,-r end thereof; (d) a third el@-ctrical coqtact obniically bonded to said first longi'@udinal surface of said crystal near said other !on.-itudilial sid,- surface thereof between said third Eroove ind said o-@ic eDd thereoll; (e) a fotirth cleelrical coiicact ohmically bonded 'Lo said first tongiludi--qal surfac,-- of saiu' cryst,-@'i nepr said other longitl,(iinal side slirface thereoi adjacent 10 said th;@rd groove on the opposite side of sa;d thii-d Iroovo- said th@rC,, electrical contact; ard, (f) a fifth elec',rical ccjitact ohmically bo-ided to sa'Ad fir.@t longitlidiiial surface of said crystal near said o'@hp-r Ion.-itud;.11-.l side si-irface thereof adjacent said i5 otlier -iid thereof. 12. A seiiiicondtictor straiii gauge conaprising: (a) m elo-@igate s-irigle ser-,iiconductor crystal of N type s@'@izon of [1111, crystallograrhic orientation, said silicon crystal defi-,iirig first and secotid opposed 20 longitud;nal surfaces, sa,,'d f@rst and second longitudinal sur.L'aces aiid th-, end surfaces of s,,iid crystal having dift,,ised therein active iiiipurity atoms of P typ@- coiiductivity to thereby define a shallow peripheral surface band of P type conductivity longitudinal25 ly ericircling said crystal exclusive of its lon,@itudinal side surfaces, said peripheral surface band of P type conductivity being electrically isolated from the remainin.- N type portion of said crystal by the hi8h iinpedance barrier provided by the PN junctio-@l there30 between, said cryslal having first and second and third linear grooves thereiii, said first linear groove beginning at a first predetermined point on said first loiigitudinal surface near one @-nd of said crystal and extending Ion.-itudinally peripherally around said 25 crystal alon.- said P type surface band to a second predetermined point spaced apart from said first predetermined point in said firstlongitudi-iial surface, said second groove being in said first longitudinal surface and extending transversely from the end of 40 said first groove at said first predetermined point to one Ion.-iLudinal side surface of sa:d crystal, said th,rd groove bein@ in said first longitudinal surface a@n@ extending tra'nsversely from the other eiid of said first groove at said second predetermined point 4,@ to the other longittidinal sid.- slirface of said crystal, said grooves extending inwardly into said crystal through said P type surface band and peiietrating the underlving PN junction; (b) a first electrical coiatact ohmically bonded to said 50 first longitudi-@ial surface of said crystal near said one longitudi-@ial. side surfac.- thereof between said second groove and said one end thereof; (c) a second electrical contact ohmically bonded to said first longitudinal surface of said crystal near 55 said oiie longitudinal side surface thereof proximate the otlier end thereoj-; (d) a third electrical contact ohmically bonded to said first longittidinal surface of said crystal near said other longitud@@'nal side surface thereof betv,,een said 6( third, groove and said o-.ie end thereof; (e) a folrth electrical contact obmically bonded to said first Ion.-itiidiiial surface of said crystal near said other longitudinal side surface thereof adjacent said third groove on the opposite side of said third groove cj5 from said third electrical contact; and a fifth eelctrical cottact ohmically borded to said first longitudiiial surfac-. of said crystal near said other longitudinal s;de surface thereof adjacent said otlier end thereof. 7o 13. A trarisducer structure comprising, in combination: (a) a-@i clon.aate semiconductor beam freely supported at its ends, said beam cons:@sting of an elongate single semiconductor crystal of predet--rmined crystallo75 grat)llic or,'@entation and of a first predetermined con-

ductivity type, said semiconductor crystal de'@ining first and second opposed longitudinal surfaces, said first longitudinal si-irface having diffused therein discrete shallow regions of a second p.-edetermined conductivity type electrically isolated from each other, 5 said diffused regions longitudinally extending lengthwise of said semiconductor crystal, said diffused regions being electrically isolated from said first t)redetermined conductivity type portion of said crystal by the high impedance junctions therebe,,N'Veen; 10 (b) a plurality of electrical contacts ohmically bonded to said diffused regions near Ion.-itudinal ends thereof to provide each of said diffused regions viith an electriclal con@Lact near each of its ends; and (e) force-summing means contaclinp. said beam inter- 15 mediate its ends and movable transversely th,- reto in response to predetermined forces whereby application of said predet@.rmined forces to said forcesumming means causes movement ol. said forceslimmi@ig means transversely to said beam to tboreby at)ply a 20 tensile stress to said beam and cause a varia@ion in the clectr@.cal resistance of each of said diffused regions, which resistance variations caD be measured by electrically intereoinect@.ng said electrical contacts so that each of said diffused re.-ions forms a different Q- 5 leg in a Wheatstone bridge circuit. 14. A transducer structure comnrising, in corpbination: (a) an elongate beam freely suppor'ted at its ends, said beam consisting of an elongate single semiconductor 30 cryst@l of predeteri-nined crystallographic orientat@'.on apd of a first predetermined condtictivity type, said semiconductor crystal defining first and s@-cond opposed lonpitudinalsuri-aces, said first and second longitudinal surfaces and the end surl'aces of said 35 crystal having diffused therein active iniptirity atoms of a second predeternined conductivity type to thereby define,a sballow peripheral surface band of said second predetermined cotiductivity type longit,.idinally encircling said crystal exclusive of its longitudinal 40 side surfaces, said peripberal siirface band of said second conductivity type being electrically isolated from the remainina first condlctivity type portion of said crystal by the high impedance barrier provided by the junction therebetween, said crystal hav- 45 in.- a transverse groove near one end thereof extending across said first longitudinal surface, said groove extending inwardly into said crystal from said first loilgitudinal surface tbrough said si-irface band and penctratin@ the underlying junction; 50 (b) a first electrical contact ohmically bonded to said first longitudinal surface of said crystal at said one end thereof adjacent said aroove; (c) a second electrical contact ohmicab'y bond-.d to said first longitudinal surface of said crystal adjacent 55 said -roove on the opposite side of said groove from said first electrical contact; (d) a tmrd electrical contact ohmically bonded to said first longitudinal stirface of sa@@d crystal body near the other end thereof; and 60 (e) force-siimming means contacting the first longitudinal surface of said crystal beam interriiediate its ends and movable transversely thereto in response to predetermi-.ied,forces w.iereby adplication of said predetermined forccs to said force-summing means 65 causes movement of said force-summing means transversely to said beam to thereby apply a tensile stress to said beam and cause variation in the electrical resistance of said peripheral surface b,,ind belween said electrical contacts. 70 15. A transducer structure comprisinf@, in combinaticn: (a) an elongate beam freely supported at its ends, said beam consisting of an elon-ate single semico-@iductor crystal of I)redet-- rmined crystalloe-raphic orient-,ttion and of a first predetermi-@ied conductivity type, 75 said semicorid@,ictor cryst,@il defiiiila,- and -qe-,ond ., Pi sL opposed @lon.-itudinal s@.irfaces, s-.id iirst aid second in-ti.-itLidinal surfacp-s atid the end surfac,-s o'l said crystal hoviig difftised ther--in active irr@ptirity atonis c," a socond predet-.rm,',i,@fd co-iiductilvi'L,,, @type lonL!,"iiidin,-,Ily encircling crys'Lal ex,-Iusive of its lon-iti-idinal sid-e sur-'caces, said peri,@heral surface ba-id of said s,-cond copdLi-"Ivity type beiiig electrically isolated from the rerv-iaining first coid,,ictivity typ-. portion of said crystal by 'he hi,-h iwpcdance barrier prc)vided by the unctioi therebetwe@-ii, said 'irst lo-r.,,itudinal surface f@,rst and seconl and tl'ird groov,-s tlicreiii, said first groo,/e exteridi-ng pp-rip.-f.-rally arolind slid crystal beam tliroug'ii the lor@,fzitudiial stirf,-,c--s ind eiid surfice tboreof, s,,iid seco@id groove bei@-,- iii said first lon-itudiriql surfEt.(,c iiear one epd of sp.-Id cryst-.1 and ex'Lend,na transversely from said P-rst groove to one p longill, inal side surface of said crystal, said -third groove being in said first loj:igitudi-@ial slirface near siid one etid of sa;d crystql ar@d c-,terlding transversely f,-oin s,,,,'@d first g.-oove to the other longitudinal sid@. stirface of sa;d crystal, said grooves exteno,@ing inwardly irto saiti crystal throljgl-i said surface b,,ind aid pen-,tratiiig the underlyiiag jtiiiction; (b) a iirst electrical contact ohiiiically bonded to said @'i r s' loti.-ittidiiial surface of said crys,al at said on-, eid thereof ad;acznt said seco@i(Igroov@@; (c) a secoid el,-ctrical contict ohmically bonded to s-aid Drst longiVi-",.'Pal silrface of said crystal body aijace-nt said seco-@iO, groove on the opposite side of said second groove irom said @'irst cl@ectrical contact; (d) a third clect,-ical coitac@ olimically bonded to, said first loiiE,,itud;pal surface o-F sa;d crystal body near the otlier end tliereff, on o-iif,- side oi- said first @-yoove; (e) a fourth electrical contact ohmically bonded to said ilrst Ion,-itudinal surfac-. of said cryslal at said otic c-@id thereof adjacent said third -roove; (f) a fifth electrical contact olin.-iicahly bonded to said first '.op.-iLudiral s@,irface of s-,irl cryst-,il adjacent said t'@iird groove oq t,@e opposite side of said third groove from said fourth contact; (g) a sixth electrizal contact ohiiiically bonded to said first longil@tidinil surface of said crys@lat body near the other end thereof on ihe other side of ,aid first groove; and (h) force-summing mcaiis contactirig the -@'irst lotigitudinal surface of s-,iid crystal b,- am intermediate its ends and movable tra-@isversely ther-to in response to predetermined forces whereby application ol' s-,tid predeterrpiii,-d forces to sa-'Id force-sumn-ing means cquses riiovoiner@t of said force-summing means trar@sversely to sa,.d beam to th,-reby apply a tensile stress to said beam and cause variation iii the electrical resistance oL' said peripheral surface band between said electrical cotitacts. 16. A trapsdue-r structure comprising, in coinbiiiation: (a) an elongate beam freely supported at its ends, said @beam co-.isisting of an clo@,i,-ate singl@ -,einico-TidLi 'elor crystal of Dredet,-r@iiined crystallo,-,raphic ond of a first predetermined co@10,ucLivity type, said sernicor@dtic'Lo--,- crystal definiig and second opposed longitudiiial surfaces, said ilrs" and second long--fuei-@ial stirfaces and the end si-irfaces of said crystal hai7ing diffused therein active ;mpurity aloms of a second predetermined conductivity type to thereby de'iie a shallow oeripheral surface band of said socg.,id predetermi@ied cor@ductivity type longitudinally encircling said crystal exclus@@l'e of its Iongitudinal s:lde surfaces, said pe:.-ipheral surface band 0 4 t said sec@ond conductivity type being el@ectrically isolated from the remaining first conductivity tljp!.por,,ion of said crystal by th-@ high impedance barrier by the junction th-,rebetN@,ceil, said crystal ii,,ivin,@ first and second and third linear - .rooves therein,

21 s,,iid first Iiiiear .-roove beginning at t i9rst predetermin,-d poilit on said first longittidinal surface near oiie end of said crystal ar@d oxtendin@,, longituditially peripheraliy aro@,irid said cryslal along said srrface band to a second predeterm;ncd i)cint spaced apart from said first predet,-rmined point in said fi,,st ll,)ngitudinal surface and extending transvers-,Iy )'rom the end of said first groove at said fir@,t predc',crmiiied point to one longitudinal side s@,irface of said crystal, said third groove beiiig in sa-@d tirst longitudi-iial surface and exterding '-.raiisversely from the r-,ti7,er ciid of s,,iid first groove aL said second predeterni-ined po@,nt to tho other lon- ttidiiial s-'de su,@:f ace o' said crystal, said grooves extending inivardly inlo -oaid crystal through said stirface baiid and penetratj-.ig the uiiderlying jlinotion; (b) a first electrical contact ohrr@ically bonded to said first longitudinal surface of ,aid crystal near said one longitudin-d side surfai-e thereof between said second groove and said one end thereof; (e) a s-,cond electrical contact olimically bonded to said first longitudinal surface of said crystal Ticar said one longiti-idir@al sid-- s-,irface tliereof proximate the other end ther.-of; (d) a t]3ird electrical contact ohpiically bonded to said first loigitudinal si,-r'ace of said crystal rcar L said other loDgitur-Iii-i-,il side surface lherec,c be,ween said third groove and sa-ld one or@d 'thereof; (e) a fourth electrical contact ohrilically bonded to said first lon,@ic,,idinal surface of said crystal near said other Ion.-ittidinal side s@,irface tliereof adjacept said third groove on the o;)posite side of said groove from said third electric,,tl contact; (f) a fifth electrical contact ohmically bonded to sa, '.d first longitudinal surface of said crystal ii,-ar said ,other longitudinal side slirface thereol' adjncent said other end thereof; and (.-) force-summing mea-.is contacting the first longit-Lidinal surface of said crystal be,,im ivitermediate its ends and movable transversely thereto in res,@otise to predetermined forces vvhereby ipplicqtion of said predetermined forces to said force-si-imming means causes movement of said force-summ;n,- means transver-.cly to said beam to thereby apply a tensile stress to said beam and caiise @a,.7iation iii the elec,Lrical resistance of said i)eriph.-ral sutface band betwee-.i said &iectrical contacts. 17. A pr-,sstire transdlcor comprisin- iii combination: (a@ a transdiicer housing cons,stitig of a base member i having a generally clip-shaped c-@ver hermetically scaled ',hereto, said base member defining a pressure port extending therethrough - commi3i,:Ical@i,-@g with 'tiie iiiterior of said housing; (b) a bellows defining an exp@t-.isible air chainl,)-@rterminating in an air inlet port, said bellows being hermetically scaled to said base me.,nber periph-ertily encir-.Iing said pressure port viithin said hoi-isin.- witli said a@'@r inlet port communic-,tting wit'i said pressure port; (c) ar. elongate rigid bar mounted by one of its ends for Ion-itudi-iial linear movement uoon expansion and contraction of said bellows, said bar defining a ti,,,insverse generally rectan,-,,ilar @iotch near its other e-rid" (d) a piezoresistive se-iisor in the form of an clonga',e bc;am supported at its end within said housing with the c-,ntrat portion of said b-- am wiihin sa;d ti-ansverse notch in said bar; aiid (e) spring biasiiig means moi,,nted within said liousiiig, said si3ring biasin@ means bein- selectively adjustable to provide a predetermi-iied force tipon said other end of said rod. 18. A pressure @ransducer as deiined in claim 17 xvhcrein said beam consists of an clo-ilgate single semi-conductor crystal of predetermined crystallogra-ohic orientation and of a first predetermined conductivily type, said semicon3,160,844 22 ductor crystal defini@ig first aiid se-,ond oi)posed lon@-itud:nal surfaces, said f@rst and second lor,.gitudinal surfaces and the end surfaces ol' said crystal containing therein active imptiri*,y atoms o4L a se-cond predetermined coner,,ctivity type to thereby defiiie a shallow peripheral band of said second predetermined conductivity type lon@-itudii,.ally ciicirclinsaid crystal excltisive of its longitudinal side si-irfaces, said surface band of said second -oredeterm,'@ned conduc-tivity typ-- being electrically isolated froiii 10 remaining first condL7ctivity type portior@ of said crys@al by tLe impedance barrier provided by the junc@,.on ther-,between, said crystal haviii- a plurality of pred-termiiaed grooves in the longit-Lidinal and end surfaces t@ereof exteriding inwardly throlgli said band and pene15 tratiiig the underly;llg junctioii, said grooves dividing said band into discrete electr;cally isolated surface r".ions of said secord prede'Lermined conductivity type, said crystal having a plurality of electrical connectors ohmically bonded to predetermined points on a longitlidinal surfa ce 20 o'L said crys',al for conrection of electrical ineasuring crciiitry thereto for measurei-neilt of c.1a,,in.-es in the electrical resistance o@' said discrete surface regions between said coiitacts upon stressin.@ of said crystal beam by said rod upon mov,-ment of said bellows. 25 19. A pressiire transducer as defined in claim 17 whereir@ spid bcain consists of an elor,.-ate single semiconductor crystal of predetermined crystallograp]2ic orientation and of a first preletermined conduct-'Vity type, said semiconductor crystal defij-.iing fi-rst ard second o-oposed Ion-i30 1 "Idina' . surf aces, said first and second longitt@dinal surf ac'es iiid the end stirfaces of said crystal having diffus-.d therein activity impurity atoms of a seco-.id predeiern-iined condtictivity tyr o to thereby define a shallow peripheral sur35 face baiid of said seco@id predetermined conductivity type loigitudiiially encircliig said crystal exclusive of its longit-adiral side s-,irfaces, said peripheral surface baiid of said seco@id coiductivity type being electrically isolated from the remain@'ng first conductiirity type portion of s.-.id crystal by the 1-iigh impedance ba@-rier provided by the juiic40 . t@@on therebe'cwe-,-i, said c2ystal havin.- P@r--t and second and tliird grooves therein, said first groove extending longitidirally pe@-i,,)I-erally around said crystal through the longiludinal surfaces ar@d end surfaces thereof, said second 45 groove beiiig in said first long:tudinal surface near or@e end of said crystal a-,.id extending transversely from said first groove to one loigitudinal side surface of sa;d crystal, said third groove being iii sa-d first longitudinal surface near said o-@ic of sa'td crystal and extending transv--rsely from said groove to the other long;tudinal side sur50 face of said crystal, said crys'al h-,tviig six electrical contacts ohm,'cally bonded to said f@rst longitudinal surface therec)f, the first electrical contact being b@,nded to said firs' lor@git@-id@'nal si:,rface near said one eiid of said crystal adiacent s-,id second -roove, the second electrical contact 55 bei@-i,,- bord,-d to sa-d iirst loiigitudinal sur'ace near said oiie ciid of sa,"d cry'stal on the ottier side olf said second @roo@tc,, from said first el,c(rical coiitact, th-. third electrical con'act beino bo@ided to said first longitudinal surface ad;ace@it the other end of said crystal near said one 60 j loigit,,Tdinal side stirface thereof, 'Lhe fourth electrical contact bei-.lg bonded to sa,'@d first lon@itudinal surface near sa@d one er@d bf sa-,d crystal adjacent said tbird groove, the iillth clectr,cal contact bein.- bonded to said first longitucii-iial slirface near said one end on the oth-,r side of 65 sa;d third groove irom s-,iid fourth electrical conlact, said sixtla electrical contact being bonded to said -iqrst lor@gitudii,.al surface adjacent said other end of said crystal near se,@ 'd other longitudinal side surface thereof. 70 20. A pressi.,re transdii-cer as deiined in claim 17, whereiii sqid be-am cons;sts of an elongate single semiconductor crystal of predetermined crystallo.-rapliic orienta' ion aid of a first predetermiiied cond@uctivi@Ly type, said semiconductor crystal definin.- i9rst and second opposed 75 loiigitudilial sur-,aces, said first and second longitudinal

surface,s and the end sur4,ac--s of said crystal hpvin.- d ffused therein active impurity ttorqs of a second predetermined coadil-ctivity type to thereby deiin@,- a shal'@Ow peripheral stirface ba,,d of s-,iid secolid @rjred.,ter-qiiiied conductivity type longiti-,d-in,- clly enci@rcling saii cryscil P--xclusive of its Iongittidinal side surfaces, sail peririier@1.1 surface band of said @seco,.id coiicluctivity type beir@.- el.,@ctrically isolated -from the remairiiig first conduct@vity typp. portion of staid crysta:l @,by th-, high imp--dancc-, barricr provided by the junctioli therebetween, said crystal ha,@;ng first and second and third linear -rooves thereiii, said first linear groovebeginning tt a first predetermined )o,',nt on said first longitl,.dinal surface ii,-Pr one elid of saicl crystal and exlending loTigitudi:@i,)Uy p@-r@,rherally around said crystal alorg s@aid surfar-,3 band to a seco:id predctermined point spaccd ap,art from said -oredeermircd point in said flrst longittid,nal sLrf,,ice, said second gi-oove bein,-, in said first longitud,',T-ial surface and extendin- transver-sely from '@he end ol' said first grc-ove at sa@'d 'irst predetermined point to otic longit-adinal side siir-@acc of s,'@i,,l crystal, said third groov@, b--ing in said first i-,ngit-c@,-';nal surface and extend;ng tra-,isve-,,:sely from the other end of said first - row@e at said second predete:rmilied poidt to the otherlongitudinal side suri'a-.e o]L sa-.d cryst!.ii, said crystal havin- five electrical contacts ohm,'@cally bo-iided to the first longi@,Udinal surface thereof, the first cal contact bein.- bond,-d to said first lor@gitudinal @,zi-irface between said second Lroove and said or@@- end of sa,' ,d crystal, the second electrical contact being bonded to slid first longitadinal surface adjacent the other end of said crystal near said one longitudinal s,'de surface th--reof, the t@hird electrical coptacl beina bonded to said first longitudinal surface b.-tween said ihird grc-ove aiid said one end of sa4id crystal, the foiirth electrical coitact being bonded to said first longitudinal s@c-rfac-- cidiacen', sai,' third groove on the other side of said third groove from said third electrical contact, the fifth elec'Lr@cal contact being @bonded to said first longitudiiial surface idjacent said other end of said crystal near said othe@r side siirface of s,aid crystal. 21. A semicondur-tor strain gliqg.- compi:isin,-- (o) an elongate single semiconductor cry@,,tal of predetermined cryst,-dlo,-rapliie oriert,- ttion and of a -iqrst 24 pred,-termin-,d coii@l-uctivity 'Lype, siid semiconductor crystal defir@in,- first and secord opposed longitudinql surfaces, said md s-,co-iid IGngitudin-,tl siir.Laces and the crid sciriaces of said cryst-,d containiii-@ th,-rein ae@ive inipuxi'@y aLoms of a second predeterniipcd co,.iductivicy type to 'Lhereby define a sh@a-'Iow 13erip'iieral sur-face band of s,.iid s@-cond predeterniin-ed co-Tid-Lic'civity @,ype encirclin.- s,.,iid crystal exrlusive of Pts lotigittidin,-J sid-- s,@,rfaces, -.aid perip'iiaral sur10 fqce band of sal:d s-,cond Taredetermiqed condtictivity ',ype beiii@- e'@ectr"@cally isolited from the remaiD@n.@ first conductivily typ-- portion of said oryst-,il by the hi.-h inifcdpiiee barrier provided by the ji,-iictioii th,rebetween, sa@@d crystal having a groove --,@tendin15 tr@,.ns,,,ersely across s@dd pcripheral suiface baild and@ penc"ralin@, ilirough s,aid junctio,,i to thereby ipterr!7tot tii@ coitinuity of said p,-riph@,Nral surf-,tce baiid; (b) ia first contacl ohmically bonded to s,-Lid to s,@iid fLrs@L longit-ddinal suriace o'L sa;d crystal Nv,;thin 20 said periph-,ral surface band cnd adjacent said groove; and, (c) A s-,coiid clectri-,al contact ol@@niica!ly bonded to si@d i.,st lopgiLc@dii,,,,tl surfa.ce of said r-ryst,,,J itlithin said perirheral- sjr-face band and idjacent sa:id groove 25 on the opposi,e sid-.- of said groove from said first electrical contact. Reterinces Citei in ih@- file of this patent UNITED STATES PATENTS 30 2,738,259 @-@llis ------ Mar. 13, 1956 2,827,367 Cox ----- ------------ Mar. 18, 1958 31008,109 Starr ------------------- Nov. 7, 1961 3,049,685 Wri,@lit --------------- Aua. 14, 1962 ,_ 3,060,395 Sandven ---------------- Oct. 23, 1962 3a 3,084,300 c;,incliez ---------------- Apr. 2, 1963 3,089,108 Gong et al --------------- i@,lay 7, 1963 OT@HER REFERENCES Forst: "Appli-,atioiis of Se-@nico@iductor Transd,,,,cers iri 40 Strti@i Gages and Rigid Dynairometers," S.E.S.A. Proc@,,-dings, Vol. XVII, No. 1, March 1959, pages 142-.Q. RICI-TARD M. WOOD, Pr,,in,7ry Exainiiier.

Описание

[1]

3 @ 1 6 0 @ 8 4 4 U-nited States Patent Office Patented Dec. 8, 1964 III,-li-R e@ -UTPUT ELEI CTRICAL STRAIN TRANSDUCERS Wil7Ai,qm I-k. M@eLcIL"n, Calif., assigiaor to Electro-0,@tk."Il qystenis, Inc., Pasadeiria, Calif., a corpora- 5 tion of C-,iAfornia l@,iTar. 22, 1962, Ser. No. 181,-.@44 21 (Cl. 338-4) This invention rel-,ttes in general to strainelectrical 10 translatin- elements aiid more particularly to high output straiii gauges employing a sen-iicondiiclor element. Transducers in whicli a force summing means varies th.- tensile stress on a p,.ezoresistive sensor are well known in the art. In these transducers a variation in tensile 15 stress c-,tuses a variacion in the electrical resistance of the sensor which is tlius t measure of the force imposed. The force summiiig i-neans may be a rod, diaphra.-m, weight, or -,tny oth,-r n-iember sub,@'ect to motion in spac@@ as a result of forces imposed t'@iercon. The force sum- 20 ming meins is the medium for summiiig of applied forces ,tnd transmitting the summed forces to tLe piezoresistive sensor or straiii galige. Through the use of an appropriate force stimmiii,@ meaiis, the tr,,itisducer may be used to measure siieh phenomena as &placement, pressure, 2 5 velocity and acceleration. I-Ience, this inveiition furlher relates ito and m,,ty be employed in the aforementioned v,trious t@ipes of transducers. Strain gauges -Lre employed in two basi-, confl.- urations: bonded and uiibonded. The device of the present inven- 30 tion is applicable to both. A tliin rod or bar of any material eniaibiting a stiffigient piezoresistance effect caii be used iii a manner similar to that of the well-kno,,vi prior axt wire strain gailiges. Young's moouliis, El relates the change ;n stress to the 35 strain by the eqtiatio-ti El E wherein S represents stress aiid c rep@-esents strain. Iii 40 a crystauiiie material such as silicon, E varies with dircetion. c in the above eqiiation, is ithe Ion-itudinal strain resultin- from sfmple longitudinal stress S assum;ng no stress in the transverse direction. The fra-,tional change 45 in resistivity diie to a stress S is AP p where 7r is the longitudinal piezoresista.-ice cocticient and 50 w'a-cre p, represents the resistivity of the malerial. Ti'lus, AP p = 'CE This can be ivritten as Me, where M is defined as 7rE. 55 Since R of any malerial PL A 6 0 i,iliere R is the resistance of a rod, p, the resisti-vity, L i,cs length and A its cro-.s-sectional area, it can be shown, for a simple c,,ise that 65 8 d-,iiotes Poisson's ratio; i.e., the rltio of the - magiii@i-ide of transvorse strain to longitudinal strain resulting from the postulated simple stress S. Iii the ab.ove e@ii-iatioii, the 70 first teriii on the right expresses thl. resistance change due to change in leigth-, ti"ie spcolid term is due to the 2 change in area, and the third teriii is due to the resistivity change. The factor K AR = 1+ 25+ 31 iFe is c-,tlled the gauge factor. Most of the commonly used w-@re strain -eoges have a gai-i.-e factor of be@tween 2 and 4. It is known that semiconductor materials exhibit a prono c p ores stive effcct and sen-i ond r cryst s ol' er n crystallograph,'@C orientation provi e extremely sensitivo s---@isors. For example, P typd silicon has a -auge factor alon- the [111] direction of over 150, thus indicating an increase in sensitivity of up to 75:1 over ordinary materials. N type silicon has a siri,@ilar gauge factor along the [100] directioil. In the semicondueor art, a re,-ion of sem,'.condi-ictor material coiitaining an excess of donor impurities and haviiig an excess of free electrons is cons-'@dered to be an N type region, whil-, a P type re-,ion is one containin-, an exc@-ss of acceptor impurities resu.',ting in a deficiency of electrops, or sta-ted differently, an excess of holes. A region ho,@,-vity doped with an N type conductivity activ-impurity is designated as an N+ region, the + indicating that the concentration of the active impurity in the region is somewhat greater than ithe minimum required to deterrqine the conductivity type. Similarly, a P+ region indicates a more heavily than normal dop-- region of P type conductl:vity. In an intrins;c region (I region), the holes and the etectrons are in balance and hence the, region cannot be said to be of either N type or P type coiductivity. When a continuous solid specimen of crystat semicond7ictor material has an N type region adjacent to a P type region, the boundary betweeq theiii is termed a PN (or NP) jiinction. The term "Junction" as used herein is in,,,ended to include the boutidary between an N re.-ion and an N+ region, and that betweeii a P region and a P+ region as well as atiy other combination of P, N, I, P+ and N+ wliieh results in Ln electrical conductivity barrier betweeii any two such adjoinin- regions. Th-- term "semiconductor materid" as ut:@lized herein is considered generic to germanium, silicon, and germanium-sil-icon alloys, silicon caxbide aiid conipounds such as iii dium-antimonide, gallium-antimonide, aluminumantimonide, i.ndiuni-arsen,'@de, gallium-phosphorus a',Ioys, ,ind indiuii-i-phosphoriis alloys and the like. The iteriil "active impurity" is used hereii to denote those impurities Nv'@iich affect the electrical rectification characteristics of semiconductor materials as distingi-iished froni other impu,@7,"ties which have no appreciable effect Lipon these charaoteristies. Active impurities are ordinarily classified as donor impurities such as phosphorus, arsenic and antimony, or acceptor impurities such as boron, aluminum, gallium aid indium. Prior art ,metallic stra,.ii gaa,-Cs, whiel, are typ,'@Cally of wire, have a relatively low gau.-c factor, as indicated above. Further, tie out@Dut signal produced by such gau,-es and Llie sigTial-tono,'@se ratio are both relatively low. Additionally' stich prior art strain gauges ai-e chara--teriz--d by inaccuracy from hyst@-resis due to plastic and metallic flow. The mechanicq@l stability ol' such wire gauge elements is relalively poor and their resistivity low. V-Ihile itlie use of semiconductor material as strain gauge elein,@its has been known to the prior art, such striiii g@Luges are not wi@Iiiout their disadvantages. Prior art sem;co@iductor straiii elements of the boided type slffer frora Piysieres;s a-@id inefficiciit coupling to the system, wh;lc pr;or art i-,-iibonded seniic I onductor strain gpuge cleiiieiits are difficult to fab.-icate and couple to the syster@i. Aclditionally, ilt'iiough prior art semiconductor strain ga-Li.,e elemeiits podiic-- greatel- voltage oLt-

[2]

puts than the wire stra;n gau.-e elements Nvhen connected i-,i the usu,,il Wheatstone briclge circuit, an even greater output is desirable. Accordingly, it -is an object of the present inv@-ntio-ti to provide improved semicoiiduc*or strain gai-iges. It is also an ob-ject of the pres@-nt iiivetiti6n 'Lo prov-ide improved transducer structtires utiliziii-. semico@@id-actor crysl,als as the p,'@ezoresisti,@e-sensors. It is another object of the presfnt invent,:oi to provide high ou,p-Lit semiconductor s@,@,iin -av,,a-,s. It is yet another object of the presenl invention to provide seiiiiconductor strain g-@ilLi.- es Nvhich are fi-e@ from hysteresis. It is a further ob,;ect of the present invent@o-@i to provide an improved integrated sciiiicondlictor strain -,au.@e elenient. . It i-s a still further object of the p@-esent i-tiv,.ntion to provide a device of the character described which lends itself to -ase of fabrication. It is also an object of the present ;nvent-lon to p-ovide methods for producing the devices of the character described. It is another object of the present invention to provide extremely sensitive and conipac@ transducer siruettires. It is gtill another object of the present invention to provide a m,-thod for ac;curately adjust@'.ng the resistivity of semiconductor str,,iin -au.-cs. The objects of the present inirenlion are accomplishcd by utilizing a piezoresistive sensor consisting of an elongate unitary body of semiconductor niat,-rial fashiotied from a s-ingle semiconductor crystal. The tipper apd lower surfaces of the elongat-. crA7stal are ef a different conductivity type from that of the main portion of the crystal body and eleclrically isolated therefrom by the high impedance barrier formed by the rectifyin.- 1",Inctions. In the illtistr,-,ted embodiments, a predetermined pattern of grooves which pene@'rate the rectifying junctions are provided in the surfaces of the crystal to fori-n dis-crete electrically isolated aciive gau-,e elemen-ts, 'he active ga@,,,-e elements being electrically interconnected so that ea6h gai-,ge element is suitable for tise in a diff,-rent leg of a Wheatstone br:idge circuit. In an illustrative embodiment, the elo-ripate crystii is utilized as a freely su-o orted beam wliich is point loaded by th-- force-sump mi-@i-, element of t,he transducer. The novel leatures which are believed to be characterisiic of the i-iiveition, both as to its o.,gE,.nizetion and method of 6 erat@on, together with further ob;ccts a7id p 'i ad,iantages tliereof, will be b@@ller understood from the following description cg@isidered ;n coniiection with tiie accompanying drawiii.- in which a presently pre-'Lerred embodiment bf the invention is illustrdted by way of ex_ a I mple. It is to be expressly Linderstood, honi,cver, that tlie, dranving ;s for the purpose of illustration and descr;-I)tion only, and is intended as a detinitioi of the liniits ,j' the inveption. In t@ie drawin,-: FIGURE I is a perslective view of an c@oi.-ate siiig@e crystal of s-,micoiductor material; FIGTJRE 2 is a cross-sectional view, in el-,vation, of the crystal of FIGURE I in an early sta,le of iroductioi upon completio-@i of a diffusion operat,o-@i; FIGURE 3 is a p-,rspect-' c vilw of th-, c@.,-ystal of IV URE I at a subsequicii@L stage of productio@i; FIGUI-,E 4 :is a D--rspective view of the crystal of Fi-@GUi-@E I at a later sta,-e of production; FIGURE 5 is a view taken along the line 5-5 of FIGl@RE 4; FIGURE- 6 is a persl)ect,'@ve view of the crystal of --PT-G. UR-E I in a later stage of prod-action upon prov.,@sion o-f electrical leads thereto; FIGU-RE 7 is an elec@rical sch,-mal,ic d@'@a,-ram of t'ne embodiment shown i@i FIGURE 6; FIGURE 8 is a plan view oz' the einbodime-,it o' i7.,C3,160,844 4 URE 6 showing 'Lhe ends of the crystal masked in preparatio-.) for an etcliing operation; FIGURE 9 is a perspective vi@ew of the copiple'Led piezoresistive sensor; 5 FIGURE 10 is a plan v;ew of the embodiment of FIGURE 6 showing an alternative masking conf!Ruration-, FIGURE 11 is a p@-rspective view showing an alternative embodiment of a pi-,zoresistive s--nsor resulting from 'c-lie mas@@"pg config-,iration showv in Fj'GURE 10; 1,,) FIGURE 12 shows another alterpative embodiiiient of q@ piezoresistive sensor utilizi-Ti@- oiily @ive - electrical leads; F-,@GURE 1.3 is a sciematic diagram showing electrical i-@iterconnection of the present invention piezoresistive sensor in a bridge circuit; 15 FIGURE 14 is an elevatio-@i-.1 view dep:@ctirg tic support ari-d loading of t@,c piezoresistive ser@sor; FIGURE 15 is an elevatio@ial view in cross sectior. of a pressure transdticer utilizing the piezoresistive sensor of the present invenl,-ion; 20 FIGURE 16 is a view taken aloiig the line 16-16 ol FIGURE 15; and, FIGURE 17 is an enlar.-ed partial view showin.- ho,.,i the crl,,s'@al beam s loaded. In co-pcndin.- pate-.it application Se.-ial No. 29,837,,en25 'Litled ".@'llectrical Strain Transdi@,cer," by Willian-i V. Wi-ight, Jr., filed Tylay 18, 1960, riow U.S. Patcnt 3,04@9,685, iss,,ied on Ati.-iis" 14, 1962, t@er-. is disclosed the concept of a piezoresislive sensc)r fornied from a semicondtictor cr37stal !,,Tvijig zo-,',--s of d@'I'@Terent cor@dtic30 tivily types therein, th-, high iirpodance barrier for.,ii@-d by the rectifying junction between zi)-ties of dift-erer@t co.,idur-tivity servi-rig lo el@ee'rically isolate the dif.F@-,rent zones -witiiout slrtictura,@@ y or thermally isolatina th,-m. A.- an example of this coiicept, -,Ltoms of a P lype active iri35 purity are diffused into the upper and lower longitudinal si-irfac,-s of aii elon,,ate uniial-y crystal of N t@7pe silicon to 'Lhereby cr,-ate shpllow P typ@ surfac.-- regions. Th,-se elongate P type surface regioris ar-. provided with elec',rical contacts at each c-@id thereof for meas.tiremcii@ of chan.-cs 4o in tiie resistance of the P type re-,;on b-.Lween ',he coiitacts iii response to physical. stresses applied to the crystal. 11- the crystal is subjected to Ion.-itudi-.ial beid@n.-, or,-- of the P tyl)e surface regio-,ls wi'.1 be subjected to a compressive stress while the P type suriacc ref,:on on the 45 olposing -s@arface be @,,ibjected to a tensil-- stress. Hence, the oppositig stirface re.-loris are con.,iectcd in opposite le,@s of a W!ieatstoie bridge cire-ait. Th,- pres@-@"L ii-ivention is an exteiisi,@,n of the aforemen'tioned coi-@cept to provide a un;tary semiccndtictor cryscal b-,aiii w:ltli 50 four ac'cive gauge el@nic-,its, t@,,ro of the active gai,,,-P, clements being on the upp-r longiludiiial surface of tlie, crystal beani and the other 'Lwo act@Ve gau, -e clern,-nts being on the lower lo,@igit,,idinal surfac.- ol. the crystal bearp. -ilius, each of the ictive gauge elements forms a 55 diqerent one of th-- fotir legs of th-. Wlieatsto@@e br-idge, thereby providng a-ii i@icreased outp,,It. T -Ti addition, although the act-1ve gauge el-.men"s are disposed or, oi)posing surfaces of the crys@al b,-,-,m, the novel str,,icture of the preseit invention provid-,s clectricpl coiinecti,,)n to oo all of the gau@e eieri,-@nts oii o-ti,- loi.,i',Ud:@nat sti.@fac@, of the crystal beam, Re'Le,-ring now to th.- drawings, and more partirularly to FIGURES I throu@h 9 thereof, there is showii the pro0 gressive st--ps in the fabric,,tion of a-ii illustrative eii-bodi65 m@nt of the presert inv-@ntion piezoregistive sensor from a single unitary crystal body. A single unitary crys'Lal body of semiconductor material ca@n b-. produced by methods and means well inown to the art, such as by growing a single crystal by withdr,,lwing a small seed crystal from 70 m-.It of sili-.on. In this e,-@emplary embod,'ment, the silia coii bocly is of N typ.- conductivity produe'ed, for example, by incl@ading a dopi,,i,- aaetit suc!l as arsenic in 'ilac molten silicon @'rom wh;ch the seed cr@istal is drawn@ A'Lter tL,@- lar,-e sinple N type con,-Itietivity crystal is thiis 75 produced, it is sliced into wafers, which wafers are then

[3]

lapped to a thickness of about 0.014 inch aild cut to a width which -,vill be the final crystal beam length, each wafer having its width dimension extending along the [111] crystallographic direction. Although an N type silicon wafer is utilized in the illustrative embodiment, a P type wafer could also be utilized with the width dimension of the wafer e)ctending along the [100] crystallo@raphic directioii. The wafers are then etched to a thickness of about 0.010 inch to remove surface damaf,,e caused by the cuttin- operations. An etch wwch is typically uscd is a 1: 1: I combliation of hydrofluoric, hydrochloric and acetic acids. Th,- wafers are th,-n placed into a diffusion furiiace containing a P 'Lype donant such as boron, for example, aid heate@d to vapor diffuse boron into the surfaces of the wafers to a depth of at least 0.00025 inch, which is the miiinum depth required for asubsequent metallizing operation. The wafer is then sawed alon.- its width dimension to provide a plurality of elongate crystal bodies approximately 0.05 inch wide and 0.5 ir,.ch in leiigtli, the extreiiie end portiolis of the starting wafer beina discarded. Thus, there results a plurality of eloiigate crystal bodies of N type silicon having a peripheral s-Lirface beind of P type conductivity. One of these crystal bodies is showii iii FIGURES I and 2 and ind-.cated generally by tiie reference iiumeral 20. FIGURE I is a, perspective view while FIGURE 2 is a cross-sectional view iaken aloii.- the line 2-2 of FIGURE 1, FIGURE 2 clearly showin-. the urderlying N type silicon portion 21 and the P type peripheral surface barid 22, the P TYPO band 22 being electrically ieolated from the N type portion 21 bv a PN junction 23. It should be noted that the N type i3ortion 21 ancl the P type surface band 22 are an integral p,-Lrt ot the crystal 20 and no physical or structural chan,@e or discontinuity is present in the crystal. The PN junction 23 is an electrical conductivity barrier only wliil-@ the crystal 20 remains a solid continuous specimen of semiconductor material. Thus, the crystal 20 remaiiis a unitary body with no physical distinctions or discontinuities present thereiii, while the N type portion 21 and th-- P type band 22 are electrically isolated, one f-rom the o,zher. Unlil-,e prior art piezoresistive sensors utilizing a PN junction, the diffused surface regio@q extends continuously peripherally around the crystal. That is, the P type band 22 completely covers the jpper longitudinal suri-ace 24 of the crystal 20, the lower longiti-idinal surface 25, and the end surfaces 26 and 27, and is exclusive of its I .oi,gi'cudinal sicle surfac@-s 28 and 29. The crystal 20 is then scribed and etched, in accordance wit-h any one of the various well kr@own techiliqljes, to provide a coiitinuous longitudinally circumferelitial groove 31 ccteridii.- through the P type band 22 and penetratin.@ the PN jlnetion 23, the crystal 20 then appearing as showii in FIGURE 3. That is, tb.e groove 31 defines a continuous peripheral band exteiiding across the ii-pper Ion-itudinal surface 24 around the end surface 26, along the lower longitudinal surface 25 and around the end surface 27 of the crystal 20. Next, two transverse grooves, indicated by the reference nunierals 32 and -13 are scribed and etched in tne upper surface 24 near the end 26 of the crystal 20, the grooves 32 and 33 extendin-. thi-ough the P type band 22 and peiietrating the PN junction 23. The groove 32 extends bet@veen the longitudinal groove 31 and the side surface 23, while the groove 33 extends from the lo-@igitudi-@ial groove 31 to the side surface 29 of the crystal 20. The grooves 32 a-@id 33 are prefer@bly offs--t, as shown, to minimize the stress cor@centration caused by the .-rooves. The crystal 20 will then appear as shown in FIGURES 4 and 5. The next step is to attach suitlble elertric contacts and leads to the crystal. This n-iay be accomplished by any well knov@n prior art technique such as metal plating followed by soldering or alloying. Alternatively, suitable nietallic contacts could be formed by an ev,,iporatio_n technique coordinated with the etching step so that the jullc3,160,844 6 tion is not e!6cirically short eircuited. In the illustrated embodiment (see FIGURE 6), six gold contacts are alloyed to the upper longitudinal surface 24 oll the crystal 20, the alloy contacts beiii- identified by the reference numerals 34-39. The -old contact 34 is ohmically bonded to the surface Z4 at the end 26 and adjacent the groove 32. The gold colitact 35 is ohmically bonded to the surface 24 adjacent the groove 32 on the opposite side of the -roove 32 from the gold contact 34. The gold contact lo 36 is ohmically bonded to the surface 24 near the end 27 betweer@ the groove 31 and the side surface 28. The gold con'cact 37 is ohmically bonded to the surface 24 between the -roove 33 and tl-@e end surface 26. The gold contact 33 is ohl-nically bonded to the surface 24 on the opposite 15 side of the groove 33 from the gold contact 37. The gold contact 39 is ohmically bonded to the surface 24 near the end 27 between the Proove 31 and the side surface 29. To facilitate el.-ctrical connection to the gold contacts, fi'amen@ary gold wires are ohmically bonded thereto. 20 Thus, as shown i-@i FIGURE 6, the gold contacts 34-39 are provided respectively with electrical leads 44-49, the electrical leads A,5 and 47 being iil'Lerconnected. lii FIGURE 7, there is shown an electrical schematic diagram corresponding to the configuration of the crystal 25 20 as sho@vn in FIGURE 6. That portion of the P typeperir)heral surface band 22 extending across the upper longi"Udinal si-irface 24 between the electrical contacts 35 and 36, and bounded on one side by the side surface 28 and on the ol,her side by the wall surface of the groove 30 31 and on the underside by the high impedance barrier of the Pli junction 23, defines an active gauge element indicated in FIGURE 7 as a resistance A, this resistance be,.ng measurable by connection of an ohmm,-ter between the electrical l.-ads 45 and 56. Similarly, that portion of 35 the peripheral surface band laterally bounded on one side by the side surface 23 and on the other side by the wall surface of the groove 31 and on the inner side by the high in-ipedance btrrier of the PN junction 23, and extending from the o.old contact 36 around the end surface 27 and 40 ,tcross the lower surface 25, around the end surface 26 and over the extreme end portion of the upper surface 24 to the gold contact 34, defines another active gauge element in,-Ii--ated in FIGURE 7 as a resistance B. The major portion of thi's second active -auge element is alon.- 45 the. lower sarface 25 of tlle crystal b,cam 20 while the active gauge element defining the resistance A is on the upper surface of the crystal beam 20. The resistances A and B are both physically and electrically connected in series since they are formed by a continuous portion of 50 the P tyge surface ba-tid 22 extending longitudinally peripherally tround the surface of the cry.-tal 20 and interr@,lpted oiily bythe transverse groove 32. An advantage of this st-uctural configuration becomes immediately appare-,it for all of the electrical contacts are on the upper 55 surface 24 of the crystal 20 while one of the active gau.-es is in the upper surface 24 and the other active gaugi@, is efi'ectively on the lower surface 25. Two r@iore active gauges are defined on the crystal 20 by that port-Ion of the P type suriace band 22 bounded 60 oii one s,.de by the side surface 29 and on th-, other side by a wal.1 surface of the gro6ve 3'-@ and ex'cending longil@idinally perit)herally around the surface of the cryslal 'A@n, i..-itcrruptea only by th-- transverse groove 33. T-lius, a third active gauge, indicated iii FIGURE 7 as a resist-ance 65 C, is pi7ovided beiv@een the @old contacts 33 and 39. A fourth active -auEe element, indicated as a resis,ance D in FIGUI-'@.E 7, is provided b.-t@vean the gold coiitacts 39 an-d 37, the four@,ii active gauge eleme,@it exlendiiig arouiid the end surface '@7 and across the lower surface 25, 70 around the eiid surface 26 and the immediace end 1)ortion of the upper sur'Lace 24 to the electrical co@itact 37. The physical location of these active gau@es on the crystal 20 is correct to mak-, a fol!r-active arni brid2c sinc-- t-h-ae, c ,iv gauges in the upper siirfa@e 24 are in o-@ic pair of 75 opposite If-,gs of the bridge, and the artive gau,@es in the

[4]

7 IoN7,rer surface 25 are in the other pa,r of opposite le-S of the brid,-e. For the indicaled size of the crystal 20, as showii in FIGURE 6, the resistances A, B, C and D are on t@ic order of 100 ohms with a O.O.'jO25 inch thickness for the P type surface band 22. A large rang-. of resistaiice values can be obtaiiied by control of the d'iffusion process which converts the original N type s,'@licon mater,.al of the crystal.20 in,o the P type materi--l at the surface and/or by chem@ically removing a small uniform layer of tne P type surface after tl,-,c contacts have be.--@i 2,ttached. The la'cter rethod permits the resistpnce to bc moiitored ,is 'ihe e' chi@i.- proceeds so th,,it extreme' y f-,-,ie control. is posSibie. Naturally, th,- length and NyidtL of the gauge h@ve a bear;n- oii the resislance as well as do the th-'@c.@-Tiess aiid e lectrical resistivity. 1, is -oossible to obtain gpuz-@- ;es,@stances on th-. ol-der of 5,(@CiO ohms wit',--C)tit diiracu!'Ly il the present -nventio-,l struc'Lure by,the use of an etchin.- tech@iique. lxhe uslial prior art untpol@ar gau.-C is @iot readily avai' able in the mos', desirable resis'livitv materia Is with r-.sistances above 1,000 o" in short '@ei,-@hs because the -auge is too small anJ thi-ti to hatidle sai,,iy. I-lowever, a h,"-her resistance gau.-C is d-,o-irable s,.nce foy,i -iven heat dissipil-'on (viatto,.@e rating), the scluare C)f tli-. maximtiiii permissible voltage is pi-onortion,,il to "he resistatice, thereby enabl'@@-i,- applicaiion ol' a hi.-hcr voltn,g.- to hi.-her resistar@ce -aug,-s. Fcr a giveii resistance ratio clian.-e i-@i ooeratioii@ a hi,-her outrut will be obtained from the gau,-e operated from iLe hi.-her 1)o'@@nt-ial. Furthermore, a high outT),,i' 1)ro-vides 'Lhe add-tio-Tial advaiitag@-, of better si--@ial-to-nois-. ratio and possible elimination of i-@itermediE,.te ariipl@'@ilers, which leads to grealer system relilability. He@n-,C, port-ions of the P tyr,,e bard 22 of the crys'Lal ol@' FIGURE 6 are etch-,d away to increase the gau,@e resistinccs. The evid portio-@is of th-. cryslal 20 are m,,isked w@'th a '@e etc'-nant suitable maskant 50 im:,,ervious to L Lo be used, tLe crystal bee,.m 20 then appear;nl- as shown iii FIGURE 8. of suitable maskants are polyethylen.- tlpc and certain @i,axes. The remaiqin.- exposed portiods of the P type baiid 22 are theii selectively etched while 'che resistances of cacti of the ac',-@,e gauge elements is coiit@inuolislv moiiitored. WI-.cp one of the actin,e e Clciiients reacr.es the desireet resisi,,,r@ce valu@-, the crystal 20 is withclrewn 'rom the c,chant bath and ihat particular actll'e gauge iiia-ked and 'Lhe crystal reinserted into the etcha,it bath until aiother -a-age is etched to 'Tic desired resistance v,-, ue. The crystal 20 is willidrawn a". the seco,id -aii,-@- is m,,isl-.ed oild thp, proc-,ss repeated unlit -,ill four of acive -auge c,-ments ar-- of tlie desired resist,,ir,ce. 'Jpop car-ri,,3!ct:ion o; tiie c[chir@-, process, the maskant is removed E,,nd th@- comD!e',ed pi.-zores,stive S:.Insor t-lieri appears as shown il'i Flt-iURE 9. Assii-iing the etchirg of the acti@,e gau.-es his becti c,,irried o-ii ukitit gau- resistances of 5,00.0 o'@-,ms are ob'a,.il,-d, i,' is se@@n that the rei@nainin,u unetcheci portio-@is ol- tlio P t3,p-- bip(J 22 a"jqcent the gold contacts are still of the o,--i.-inal tli,'@cT@ ,iess wil iieh -,,ive a 100 ohm -ati(,,e resistance. Helice, these reina-.'n;n,, ti,@ic',-Cr porl,"ons ire of a res,"st@,ice -@ot in excess of 100 or@ms ard so provide not iii c,@cess oll 2% of t'@-e act-IV'- r--Sistcince. Therefore, even '@hough Lhese t'@iicker po.Li,,-ns are partly act:Ve because part of tiif,,m will b.- in the strqiiied are-,t of the beam, the @reat m-ajority o'L the res:stance chan.-c due to pliysical stresslii.wiil appear ir, thc@ thinper ellched central. porl@ions. I-lenc--, the act-ve gau.qes are eff-.ctively de@'illed in the upt)er and lower su,.--@laces of the crystal 20. The co.,-.iolel,ed P,'.ezores:st@ve sensor of R-IGURE 9 provides a loi.-itudinal beam v@hich can be loaded qid supported in var.,ous ways. Orc particrlarly des@"rable load a:ici s,,ippo,-t coir@b,nac@o-ii, @,s w;ll be discii.@sed ;.@-I grw,cr detail bere,'.nbelow, ;s a point loade@i freely SuPr,orted bcaiii. W'@th this ',yt3a of loacling, t@e b@-am is f-@-Cely su-o-oorted at its enis Prd iioint '@oaded, nc,,ir i@Ls ce.-@ter. With this r-.arti-,rlar type of loadiq,-, E, -,I'ght' @Y 3,160,844 difierent beam configuration, wli--rcii the cen'tral loaded @ection of the b.-am is of andim,,'nished thickn@.ss, will be desirable :n certain@nstances. FYGTJRES 10 and 11 of the drawipg illustrlie the prodii'ction of such a bea.1-i _from the crystal 2-5 embodime-@it as st-iown iii FIGURE 6. As shown in FIG'URE '10, the maskant 50 is applied iiot oniy to the end portions of the cryscal, but also to a central transverse ba-@id port@'@on of tho crystal '@0. The@-i, dro,i complet,on oll the etch@A-ig process witti t'-Ie ceiitl7,11 10 band -rortio@i masked, tho re@.ult:@n.- piezoresisL@V-1 s@nsor will the-ii appea,- as shoi,@n iii F-@IOURE II, iliis altern@it ,'@'Vi-embodiment bi@;n,- @encrai'iy illd'ca'Led by the reference numeral 40. l' will be noted that iii bot@i of 'Llie e-riibod@"In.-nts showq 15 ill FIGURES 9 ar-d 11, orly s@'@x electrical ieads are necessary fo.- iiilelcciiriection of the act'lve -au.-Cs in P. bridge circuit, rathcr than the -tisual eight electr;cal leads. However, it is possibl-- by a ditrerent arrp..ii.-emer-il, of grooves 'lo prov@de the des,',tcd four-a,-tive -,irm bricige circiiit wi@!i 20 Oil"v five -Icct.-i--al !Lads bc;ng requirej. Thds, upoii ob tqin@@llg a crystil 20 in the confi.- uration slowii in FIGURES I ind 2, g-oo@,es ire cut th.@ Li,,--)per ar.-cl lower a--@,,,l c-iid stiriaces to result ;n @he cor@@ig,,jra'@ion shown in,F'-@'GUPE l@2 in this embod'mer@t, a co@it,nuous f,,roovo 55 2,3 ex'L-z@ids loiigi!Udinally perirh@--rally -,round th@- crystal 20 beg,.nniii.- at a point 55 in the uppeist,,ri@ace 24 @.paced away fron the end surface 26 z,,r@d extendi@-i,,, to and around the end surface 2'7, 'ion-itudiii,,.Ily Pcross lower surf-,lce 25, arouiid !he end surface 26 a-ti-J over Llie 30 -@mmediate e-@id pc)rt;@on ol- the ,ipl)cr surl,-,c.- 2@. to a poi-.ill 57 'iorigitudiiially si)aced froiii the poin" S6 and between the point 56 ard the ey.,d surl'ace 26. A traiisverse groove extepds from the, poin' 57 to tl-e side surtace 2'a, and a transvers-, groove 59 extene6 1-Fom the -@)o;iit 56 to the s,',de sui7face 2-9. The g@oov,-s 55, ---3 i-@id 59 all extend ti@rouf,,'ii the P type suriace bind 22 and i7,,-n,--trate '(h.., uil,-Icrlying PN jlinction 23. The c;ysi-,il is theii provided witli f,@ve -old cont,,icts aiid elec'Lrical leids, the electrical leafis being ;dentifi,-d bv ilie r-,.'cere,-ce Dumerals61-61@-. d-O TI@ic clectrical@ leld 61- is ohmically bo,-iled @,o t'-.ic Lipp,-r so-face ',4 between the @roove 53,and 'Lhe ec,.-e, surface 26. Tiie ciecirical lead 62 is ohniically boi-iied to the qilrfice 24 near 'Lho erd 27 be' groove 55 an,-@- tiie sl:dc I'@ll -i stirf'ace 23. T!ie c'iec"r-ical Ic,-,d 63 is oli-Tpicilly bonded to i5 the qdl:!er surfa.-e 2,11 b@f@71e?n t!ie aroov-,@ S-) and th@- epd surl-@ace 2u. T:rt- electrical Icl@', 6@- is o'@,m'@c-.-?,Ily boyidect to the uiner st-irface 2i riepr the groove 5@5 o-.i the oliier side of greoi,e ',"9 from ',he elcelr;cal lead 63. 'I'he elee',rical icad CS is chmicilly bor@,led te, the upp-.r surface 50 2@-- ricat the end ?7 and between f,@ic -roove 55 and the side slirfac,- 29. Th-- cry-,tal :@s il-@en Su-bject.-d to the afo@-cm-@nlionel mas!ciig 2@id etchin@- sieps to -,rovidc desired active gau.-@' r--Q.,'@sta@ic,s. Again, -@"otir act-.'@,e are orovidel, wilh two gau.@is cii th@ u,.)p@,@. surface 24 1.5 c-f 'Lh-- crys@al a;,d two -aug,-s o--@i thp. lowersiArf,--.ce @',S 0 tL!e crystal, the accive ,quges b,-,.'I-lg both ph,,,sically a,.id ei-,clrici.l@ly co-,iiie,-"ed i.1 se.-'@es between tt-ie electrical IcaOs aiid 61 w;-Lli the in nroloer oric,.itation and local;op for a four-active arm bridge circuit. In the piezoc@o resistive sensor ere@bodiri-i-rnts si,@own iii FL-GUR-RS 9 and 1 1, it @@,,as necessqry tointerconnect tLr-- electrical leads "5 and 47 to com@Diete the ser.i,-s conr;--c'L:@o@i of gaugc clemeits. lic-,@iever, in the ei-iibodily,.crt of the I)iezo, resisti,,,z sensor si'own in F,'C-,UTIE 12, no .nLereoin65 o4--, e!ectrical leads is necessary due to interruption oil 'Lhe lopgi'utdinal -ocriphe,.al groove 53 betw-.ep tlc r@cir@ts I'@6 and 57. Aga,'@--,i, -,IIciectrical contpcts are niarje to ',he udo@l%r suriace of the cj:ys'@al beam. 0-ther @rclove eclifig@,irat-io-@is, utilizi,@i,- @-lh-, presf@-,-Lt coilc,;,,I)tS, will 70 becoiic appar.-rt 'o ti-ose i-ii the ar@, and ,ire ivi.' ir the so@or ,,c of 1,L-- iiivent;on. in FIGURE 13 c@f the th@re is -.hc.-@@in the e'@cet@ical @-c'ricmaVc 0..iai,,ram oi. a com,,)Icte Wh--ais,@oi,.- brld,-.-e;!7-,cr ol' tnc six 'ic.-,d p@ezores;st@@,c b 75 c,@u ociiments of F-IGUR'@S 9 @-@id 11. T'@l@ sc'@,oriatic

[5]

diagram of FIGURE 13 is based upon a schematic diagram of I-'IGURE 7, to which has been added an adjustable resistor 66, a voltme,@er 67 and a voltage source 68. The adjustable resistor 66 is connected between the electrical leads 44 and 43, the adjustable resistor 66 being provided with a slidirig arm 69. The voltage source 68 is connected between the sliding arm 69 of the adjustable res;stor 66 -,nd the interco-@inected leads 45 and 47 by respective ellectrical leads 71 and 72. Thus, the adjus,able resistor 66 provides a zero adjustmert for the bridge circuit. In FIGURE 14 of the dra@vin.-I there is shown an elevational view depicting the use of '@he piezoresistive sensor 40 of FIGURE 11 as a freely sudported, point loaded beam. TI-ic ,irrows 73 and 74 depict ',he poiiits oll support, while the arrow F indicates ihe po-'@nt of application of a loading force. VAen loaded as shown, the active gauges on the uppor side of the sensor will be subjee'Led to compressive stresses -vvhile t@ic gauges on the lower s:dc of the sensor will be subjected to teris;le siresses. Th,,,,s, in the scheniatic diagran-i of FIGUI@E lo', chan,-es iii the resislances A ir@d C will reflect compress@ive stresses aild chan-es in the resistances B and D will i-eflect tenshle stresses. Since all four of t!ce bridg@- arms are active, t@te brid-e output voltag-,, as ind@"cated by the voltmpter 67, will be approximately twice that of the uoual Wheatstone br,'dge circu-IL utiliz,"ng only two active arms. And, siice the stress distribition curve of a freely supported b,-am is oil iiiuch iiiore grad-L.,al slope ibpn the stress distribution curve of a b,-am clam,)ed it its ends t@ic eeti-,,e ga,,ige elements arepractically uiiiformly stressed over their length at the full stress value, the effect-1ve g,-@u.@e I-,ngtiis being only a port,'.on of the entire bearii len@,@ii. In addition, all of the advaptages of using an integral s@niiconductor crystal bojy are present. The br,.dge circuit is ralatively s@able since there are no si.-nificaiit thermal gradients botween tho active gau.-c elements and because of the absence of hysteresis. Referring now to FIGURF-S 15, 16 and 17 of th-- drawin-, there is shown a practical applicat-on oi the pi,-zoresistive sensors of the presen4@ irvention ;n a novel presstire transducer. Tiio transducer ;s contairied @,vithi-@i q@ housing defined by a base support 31 having -,t cup-shaped cover 82 herme'@ically sealed thereto.. The base 81 defincs a cylindrical pc,-',-stal 83 extendin.@ upwardly from a slipporf,ing disc 34. A central tbreaded aper@'ure o'6 exten@-I ,s inwardly 'irom the lov@7er surface 87 of the disc 8A for accommodaiio-Ti of a threaded pressure fitting. Extendilig ii-iwardly frorii 'c@he upp-.r surface 83 of the pedestal 83 is ,in aperture 39, the ,)perture S9 bei@ig ii-@ co-icentric al' ignment with tlic, threaded aperture 86 and in comiiiunication tliore,A7ith (see FIGURE 16). CireLmferentidly spaced arou-rid the pedestal portion 83 ol' the base stipport 81 ar-..- six electrical terriinal rods 91, the rods 91 exiending t'@h-r,ugh the disc porlion 84 and insulated tleref@- om by glass-to-.nietal seals 92. CentTally mounted to the upper sur'@lace 88 ol' the base support 81 a cyli-@idrical bellows 95. The bellows 95 is eirctilar ;n sh-,pe and has corr,,i,-ated upper and lower iaces 96 and 97. The cen'L@.al portion of the lower face 9,7 defines a circular mounthig @--iaii.-e 98 having a coticentric hole 9'@,l of the same di@imeter as the -,tperture 39. T'lle bellows .1@'5 is mour@ted to th,- base sti_pport 91 by solderi'r,@ the inoiinling flan,-e 98 to ilic upper surface 38 w7th the Lol,@ 99 in ali.-Pment w-i'Lil the ap,,rture 39. Aloui-ited to the base stipport 81 at diat-@ictrically OPT)OSite points on the periph--ral suri'ace ol the pedestal P(-,rt-ioii 83 .ire '@Wo flexible beam sup ort naei---@bers 102 aid @. p 102. Thle beam su-oport members 101 and 102 are preferably constructed o,' slain'iess steel sh@'@m stocl@-I and are spot wel,,Icd to the side stirf,,ices of the pedestal 83 in vertical alignment. As slionvn in FIGURE 15, the projectirg ijpper ends of the f'iex@'.ble beam stipports extei-id abov.- the UT:)i)er @@Lirface 9@5 of th,- bellows 95 and coiit-,iiii transverse no'Lches -lor receptive engageiiie-tic of the crystal bcaiii 3,160,844 10 -niezoresisive sensor, the sensor 40 being rigdly secured thereto by epoxy cement. The flexibilty of the beain support members 101 and 102 provides a satisfactory approx;mation of an ideal s;mple support in which rotat;on and transiation -,re freely permitted, w-ithout -,Ilowin.- defleclior i-@i the support or react-Ion direction. Thc, crystal beam forming the piezoresistive sensor 40 is centrally loaded by means of a force arni 105 mounted to the upper surface 96 of the bellows 95. The force rod 10 105 is -enerally of a C-shape to t'Lereby define a reetan.-ular notch 10,13' through which the central port-,on of the piezor,sistive ser@sor 40 passes. Mounted to tl3e upper horizontal surface of the notch 106 of the force rod 105 is a J'cwel 107, the lowermost surtace ol- t-lic jo,@vel 107 15 b@-ing 'traisversely rounded (see FIGURE 16). Mounted to the lower horizontal surface ol. the notch 106 of 'the force rod IGIS is a jewel 1103, the u,,,perniost suriace of the j-,wel 108 bein.- transversely rounded. Thir. iretal shims are utilzed, if necessary, between the jewels 107 20 and 103 aiid the mo-c,.r@tiiig surfaces of the notch 106 to mpk- the round.-d surface of the jewels bear tightly against the p@,,zores;s,ve ser@sor 40. Tlius, exnansion or contraction of the bellows 95 in response to changes in bellon@is 1)ressure wil@l cause u-@)ward or downward loadii-i.- 9_5 of the crystal beam p;ezoresistive sensor 40. The viezoresist'@Ve sensor 40 is preloaded w,.th a force F by means of a bias sprin- and adjusting screw assembly. A bias sprin.v 111, in the forni of an elongate strip of stainless steel li-,ving its ends spot-welded to the base 3o support 81 at dialli-Itrically opposite points on the peripheral surface oi tlae pedestal poriioi-i $3, has a weld nut 112 at its middle portion directly over the piezoresistive sensor 410. Threaded throu@h th.- nut 112 ar@d tlarough a suitable tocrttire in tic bias spring III is an adjusting screw 113, 3 @.- sliowii in dete,,il in FIGURE 17. i-lie lower point of the adjusti-.i,- screw 113 bears aga,@nst th-@ upper surface of the force rod 105, and adjustment of tl-ie screw 113 thereby provides an ainouiit o-f preloading of the crystal beam sepsor 4,-O by the desired force F. It is desirabl.- to pre40 load the sensor 40 with a force F at atmospheric presstire to provide a pred@-termined nmount of beam flexion, so that upon an increase in pressure in the bellows 95, the beam w;ll be decreased in flexion and ultimately flexed intheolberdirection. Thisuscofbo tlioositiveaidnega4;- ti,,,e beam deflectio-Ti enables a strain change of double the maxiw-um strain magnitude, thereby resulting in the highest resistonce cliange (and therefore output) possible for a given straiii level For the 0.01 inch thick silicon crystal ulilized as the piezoresistive seiisor 40, a deflection of 50 0.001 ir@ch will give 7,700 p.s.i. stress in the gauge area. The strain, foiind by dividing the stress by Young's modulus,is2.85XIO-GstrainperO.001ilichdeflection. Acentrpl beam defl@,etion of plus or minus 0.003 inch would therelore result in a plus or minus 850 microstrain. For ,55 a typical sen-iiconductor strain gauge factor of 120, a plus or miiius 0.003 inch de,flection would result in a plus or minus 1001o resistaiice change. Iii practice, the hereinabove d-,ser,'@bed p:iezoresistive sensors 40, having a length of 1/2 incn a-@id a maximiim th;ckness of 0.01 inch, have 60 beeii us6d at a deflection of plus or minus 0.002 incl, with hi@- h'@y satisfactory results. Accordingly, the adjusting screw 113 is idjusted to catise the crystal beam center to bedeil-,cted downwardly toward the bellows 95 by 0.002 inch. 65 In the conslruction of the illustrated pressure transducer, the bellows, the b--am assembly, and the bias spring -is-embly are iiiounted to the base si@idport 81 before mounLI "iig of 'Lhe cover 82. Upon soldering of the electrical leads 44-49 of the piezoresistive sensor 40 to the 7( appropriate eleelrical terminal rods 91 (only the electrical leads 48 aiid 49 b-,in.- shown in FIGURE 16 in the interest ol' clarity), tiie adjusting screw 113 is adjus@led to provide the desired 0.002 inch deflection of the crystal beam. The cover C@2 is th@n moiinted and hermetically 75 sealed to the bas-, suvport 81 by soldering. An access

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